PRiME 2016

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Our Sponsors
































Symposia Sponsors

We thank our symposia sponsors

Symposia sponsors enable ECS to support the travel expenses and registration fees of invited speakers, students and researchers with limited financial resources. For a full list of symposia sponsorship benefits at the PRiME 2016 meeting, please see page 7 of our sponsorship and exhibit brochure. If you have questions about symposia sponsorship, please contact John Lewis at 609.737.1902 ext. 120.

Symposium sponsors


Platinum level

Air Force Office of Scientific Research
L02 - Molten Salts and Ionic Liquids 20




Office of Naval Research
I01 - Polymer Electrolyte Fuel Cells 16 (PEFC 16)




U.S. Army Research Office
L02 - Molten Salts and Ionic Liquids 20




Gold level



Applied Materials
G05 - SiGe, Ge, and Related Materials: Materials, Processing, and Devices 7



GLOBALFOUNDRIES
G05 - SiGe, Ge, and Related Materials: Materials, Processing, and Devices 7





Lam Research Corporation
G03 - Atomic Layer Deposition Applications 12
G04 - Processing Materials of 3D
Interconnects, Damascene
and Electronics Packaging 8



Product Systems Inc.
H02- Semiconductor Wafer Bonding: Science, Technology and Applications 14




Sumitomo Electric Industries, Ltd.
L02 - Molten Salts and Ionic Liquids 20




Tokyo Electron Limited (TEL).
G03 - Atomic Layer Deposition Applications 12




U.S. Army Research Office
I01 - Polymer Electrolyte Fuel Cells 16 (PEFC 16)



Silver level

Air Liquide Advanced Materials
G05 - SiGe, Ge, and Related Materials:
Materials, Processing, and Devices 7

ASM
G05 - SiGe, Ge, and Related Materials:
Materials, Processing, and Devices 7

EV Group
H02 - Semiconductor Wafer Bonding:
Science, Technology and Applications 14

Picosun
G03 - Atomic Layer Deposition Applications 12


Bronze level

Arbin Instruments
A01 - Batteries and Energy Technology Joint General Session

Applied Microengineering Ltd. (AML)
H02 - Semiconductor Wafer Bonding:
Science, Technology and Applications 14

Bondtech Co., Ltd.
H02 - Semiconductor Wafer Bonding:
Science, Technology and Applications 14

The Committee of Battery Technology, Japan
A02 - Challenges in Advanced Analytical Tools
and Techniques for Batteries:
A Symposium in Honor of Prof. Zempachi Ogumi

FEI
G05 - SiGe, Ge, and Related Materials:
Materials, Processing, and Devices 7

Fuji Electric Co., Ltd.
H02 - Semiconductor Wafer Bonding:
Science, Technology and Applications 14

Gelest
G03 - Atomic Layer Deposition Applications 12

Horiba, Ltd.
C02 - Oxide Films:
A Symposium in Honor of Masahiro Seo

Kanto Chemical Co., Inc.
L02 - Molten Salts and Ionic Liquids 20

KOEI Chemical Company, Limited
L02 - Molten Salts and Ionic Liquids 20

Mattson Thermal Products GmbH
G03 - Atomic Layer Deposition Applications 12

Mitsubishi Heavy Industries Machine Tool Co., Ltd.
H02 - Semiconductor Wafer Bonding:
Science, Technology and Applications 14

Musashino Engineering
H02 - Semiconductor Wafer Bonding:
Science, Technology and Applications 14

Nichia Corporation
H02 - Semiconductor Wafer Bonding:
Science, Technology and Applications 14

Nippon Chemi-Con Corporation
C02 - Oxide Films:
A Symposium in Honor of Masahiro Seo

Park Systems Corp.
G05 - SiGe, Ge, and Related Materials:
Materials, Processing, and Devices 7

RASIRC
G03 - Atomic Layer Deposition Applications 12

Sumitomo Metal Mining Co., Ltd.
L02 - Molten Salts and Ionic Liquids 20

X-FAB MEMS Foundry GmbH
H02 - Semiconductor Wafer Bonding:
Science, Technology and Applications 14


ECS Division supporters

Battery Division
I01 - Polymer Electrolyte Fuel Cells 16 (PEFC 16)

Corrosion Division
C04 - Pits & Pores 7:
Nanomaterials Fabrication Processes, Properties, and Applications
C06 - Metallic, Organic and Composite Coatings for Corrosion Protection
F02 - Electrochemical Impedance Spectroscopy:
In Honor of Bernard Tribollet
I01 - Polymer Electrolyte Fuel Cells 16 (PEFC 16)

Dielectric Science and Technology Division
G01 - High Purity and High Mobility Semiconductors 14
G03 - Atomic Layer Deposition Applications 12

Electrodeposition
G04 - Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 8
L02 - Molten Salts and Ionic Liquids 20

Electronics and Photonics Division
G01 - High Purity and High Mobility Semiconductors 14
G04 - Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 8
G05 - SiGe, Ge, and Related Materials:
Materials, Processing, and Devices 7
H01 - State-of-the-Art Program on Compound Semiconductors 59 (SOTAPOCS 59)
H02 - Semiconductor Wafer Bonding:
Science, Technology and Applications 14
H03 - Thin Film Transistors 13 (TFT 13)
H04 - Low-Dimensional Nanoscale Electronic and Photonic Devices 9
H05 - Gallium Nitride and Silicon Carbide Power Technologies 6
H06 - Fundamentals and Applications of Microfluidic and
Nanofluidic Devices 3
H07 - Emerging Nanomaterials and Devices

Energy Technology
I01 - Polymer Electrolyte Fuel Cells 16 (PEFC 16)
L02 - Molten Salts and Ionic Liquids 20

High Temperature Materials Division
C03 - High Temperature Corrosion and Materials Chemistry 12
I02 - Solid State Ionic Devices 11
I03 - Electrosynthesis of Fuels 4

Industrial Electrochemistry and Electrochemical Engineering Division
F02 - Electrochemical Impedance Spectroscopy:
In Honor of Bernard Tribollet
I01 - Polymer Electrolyte Fuel Cells 16 (PEFC 16)

Luminescence and Display Materials Division
C04 - Pits & Pores 7:
Nanomaterials Fabrication Processes, Properties, and Applications
J01 - Luminescence and Display Materials:
Fundamentals and Applications
J02 - Materials for Solid State Lighting

Nanocarbons Division
H07 - Emerging Nanomaterials and Devices

Organic and Biologic Electrochemistry
M02 - Microfabricated and Nanofabricated Systems for MEMS/NEMS 12

Physical & Analytical Electrochemistry
H06 - Fundamentals and Applications of Microfluidic and Nanofluidic Devices 3
L02 - Molten Salts and Ionic Liquids 20
M02 - Microfabricated and Nanofabricated Systems for MEMS/NEMS 12

Sensor
H06 - Fundamentals and Applications of Microfluidic and Nanofluidic Devices 3
L02 - Molten Salts and Ionic Liquids 20
M01 - Chemical Sensors 12. Chemical and Biological Sensors and Analytical Systems
M02 - Microfabricated and Nanofabricated Systems for MEMS/NEMS 12

Registration

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Meeting Program


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Important Dates

Abstract Deadline
April 15, 2016

Registration Now Open!

Travel Grants
June 10, 2016

Exhibit & Sponsorships
June 15, 2016

Early-Bird Ends
September 2, 2016